Invasive MCU Extraction

Invasive MCU Extraction could be viewed as the most effective and brilliant technology for the whole MCU reading industry. As we all know the Microcontroller code extraction technology can be separated into three different categories, first is un-invasive MCU cracking and reading, second is semi-invasive MCU breaking and third is invasive microcontroller unlocking.

Invasive MCU Extraction could be viewed as the most effective and brilliant technology for the whole MCU extraction industry. As we all know the Microcontroller code extraction technology can be separated into three different categories, first is un-invasive MCU cracking and reading, second is semi-invasive MCU breaking and third is invasive microcontroller unlocking
Invasive MCU Extraction could be viewed as the most effective and brilliant technology for the whole MCU reading industry. As we all know the Microcontroller code extraction technology can be separated into three different categories, first is un-invasive MCU cracking and reading, second is semi-invasive MCU breaking and third is invasive microcontroller unlocking

Invasive MCU unlocking need to contact the MCU internal structure directly, if there is a security mode or watch dog, then we need to open it and then read the memorizer content in the MCU. As for the smartcard or microcontroller, we need to open its package before MCU at89ls63 eeprom extraction, use focus ion beam or laser to remove the deactivation layer and then get in touch with the internal wires embed deeply beneath it.

Invasive MCU cracking need to be equipped with excellent facilities and extractioner with great amount of experience. Meanwhile, accompany with the increase of MCU complexity and decrease of MCU size, the cost of extract microcontroller heximal become higher than before. Some operations such as decapsulation or chemical erosion can be completed by almost anyone which require only little investment and limited knowledge. Furthermore, if we read the mask rom with old version use optical method of reverse engineering the MCU with only two metal layers and one micron wire space could be much easier.

Normally, the expensive invasive MCU cracking will be used as the way to understand MCU, and then find better solutions for cheaper and faster un-invasive microcrontroller breaking.