Modern hardware often relies on secured, locked, and encrypted microcontrollers (MCUs) and microprocessors to protect critical firmware, source code, or EEPROM data. However, advanced techniques like Extract Chip by Laser Cutting & Focus Ion Beam (FIB) are increasingly used by researchers and attackers to decapsulate, attack, and recover otherwise protected content.
By physically exposing the chip using laser cutting, and then precisely targeting internal connections with a focused ion beam, experts can crack security fuses or reroute readout paths. This allows the extraction or dumping of flash memory, binary files, and program data stored within the device. Once extracted, this data can be decoded, decrypted, and even replicated or cloned, allowing for duplication of proprietary designs.
These invasive methods not only break through locked protection mechanisms but also make it possible to hack and copy valuable archives from devices once considered secure. The decoded firmware can then be studied, reverse-engineered, or reused. While these processes are technically demanding, they raise critical concerns about hardware security and the vulnerability of supposedly secure embedded chips.
When extract chip, we will normally find the deactivation layer cover on the aluminum wire connection internally, so the deactivation layer must be removed. The most convenient method is using laser cutting to remove the deactivation layer which is a critical step for MCU Cracking.
Ultra-sonic laser cutting can be used to remove the POLYIMIDE or other organic layer which are generally will existence on the top of deactivation layer. Ultra-sonic laser cutting can also be use to strip off the deactivation layer, for example, green laser being used to cut the metal wire, and red laser being use to cut top layer metal and make access to the second metal layer.
Focus Ion Beam
As for the chip with 0.5micron or below need more effective and advanced facility to establish the internal wire connection for MCU ATMEGA162L Code Reading. That is the focus ion beam station which can not only build the test point, it can also being used to image and recover when extract chip. In the failure analysis, focus ion beam can be used to cross section and failure analysis. It has very good space resolution and preciseness which is very important for chip extract, its preciseness and space resolution is good enough to make detecting point on the crystal transistor on the chip with sub-micron technology in the process of Extract MCU ATMEGA8P Code.
Focus Ion beam work station for chip extract include a vacuum chamber, a electronic gun through which the gallium ion inject out from the liquid cathode and make it to beam which has 5 to 10 nano meter for extract chip. Through increase the electricity level of ion beam the chip material can be removed and cut off.
