Extract Chip Firmware can help to bring a 100% clone of firmware out from IC chip. Advanced Imaging Technology can also be the semi-invasive chip firmware extract skill. Include the infrared radiation, laser scanning and thermal imaging. Some of them can be used on the rear side of chip extract, it is very impactful on the modern chip which has the multilayer metal design. Some of these technologies can even observe the individual transistor inside chip.

The flaw defect of Semi-invasive chip extract can modify the content inside SRAM, OR change the status of each transistor inside a chip when extract, this can almost control the operation of chip limitlessly or use any kind of protection mechanism.

Compare with the un-invasive chip content extract, semi-invasive need to decapsulate the external package of chip. But the facility can be much cheaper than the complete invasive chip extract. And can complete the extract within a short period of time. Meanwhile, it can be minimize to the certain scope, sufficient skill and knowledge can contribute to the chip software extract swiftly and simple.

There is some operation when chip dump extract, such as searching security fuse, can be performed and executed automatically. Compare with invasive chip archive extract, semi one doesn’t require precise location, it will normally have effect on the transistor of all or part of area.